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A radiative vapor condenser sheds heat in the form of infrared radiation and cools itself to below the ambient air temperature to produce liquid water from vapor. This effect has been known for centuries, and is exploited by some insects to survive in dry deserts. Humans have also been using radiative condensation for dew collection. However, all existing radiative vapor condensers must operate during the nighttime. Here, we develop daytime radiative condensers that continue to operate 24 h a day. These daytime radiative condensers can produce water from vapor under direct sunlight, without active consumption of energy. Combined with traditional passive cooling via convection and conduction, radiative cooling can substantially increase the performance of passive vapor condensation, which can be used for passive water extraction and purification technologies.

Directed self-assembly of block copolymers (BCPs) enables nanofabrication at sub-10 nm dimensions, beyond the resolution of conventional lithography. However, directing the position, orientation, and long-range lateral order of BCP domains to produce technologically-useful patterns is a challenge. Here, we present a promising approach to direct assembly using spatial boundaries between planar, low-resolution regions on a surface with different composition. Pairs of boundaries are formed at the edges of isolated stripes on a background substrate. Vertical lamellae nucleate at and are pinned by chemical contrast at each stripe/substrate boundary, align parallel to boundaries, selectively propagate from boundaries into stripe interiors (whereas horizontal lamellae form on the background), and register to wide stripes to multiply the feature density. Ordered BCP line arrays with half-pitch of 6.4 nm are demonstrated on stripes >80 nm wide. Boundary-directed epitaxy provides an attractive path towards assembling, creating, and lithographically defining materials on sub-10 nm scales.

Foam materials are widely used in packaging and buildings for thermal insulation, sound absorption, shock absorption, and other functions. They are dominated by petroleum‐based plastics, most of which, however, are not biodegradable nor fire‐proofing, leading to severe plastic pollution and safety concerns. Here, a fire‐proofing, thermally insulating, recyclable 3D graphite‐cellulose nanofiber (G‐CNF) foam fabricated from resource‐abundant graphite and cellulose is reported. A freeze‐drying‐free and scalable ionic crosslinking method is developed to fabricate Cu²⁺ionic crosslinked G‐CNF (Cu‐G‐CNF) foam with a low energy consumption and cost. Moreover, the direct foam formation strategy enables local foam manufacturing to fulfil the local demand. The ionic crosslinked G‐CNF foam demonstrates excellent water stability (the foam can maintain mechanical robustness even in wet state and recover after being dried in air without deformation), fire resistance (41.7 kW m⁻²vs 214.3 kW m⁻²in the peak value of heat release rate) and a low thermal conductivity (0.05 W/(mK)), without compromising the recyclability, degradability, and mechanical performance of the composite foam. The demonstrated 3D G‐CNF foam can potentially replace the commercial plastic‐based foam materials, representing a sustainable solution against the “white pollution”.

Single‐crystalline inorganic semiconductor nanomembranes (NMs) have attracted great attention over the last decade, which poses great advantages to complex device integration. Applications in heterogeneous electronics and flexible electronics have been demonstrated with various semiconductor nanomembranes. Single‐crystalline aluminum nitride (AlN), as an ultrawide‐bandgap semiconductor with great potential in applications such as high‐power electronics has not been demonstrated in its NM forms. This very first report demonstrates the creation, transfer‐printing, and characteristics of the high‐quality single‐crystalline AlN NMs. This work successfully transfers the AlN NMs onto various foreign substrates. The crystalline quality of the NMs has been characterized by a broad range of techniques before and after the transfer‐printing and no degradation in crystal quality has been observed. Interestingly, a partial relaxation of the tensile stress has been observed when comparing the original as‐grown AlN epi and the transferred AlN NMs. In addition, the transferred AlN NMs exhibits the presence of piezoelectricity at the nanoscale, as confirmed by piezoelectric force microscopy. This work also comments on the advantages and the challenges of the approach. Potentially, the novel approach opens a viable path for the development of the AlN‐based heterogeneous integration and future novel electronics and optoelectronics.